HiScript II 1st Strand cDNA Synthesis Kit (+gDNA wiper)

• Catalog Number: R212-01
• Category: Assays and Kits
• Description: HiScript II 1st Strand cDNA Synthesis Kit (+gDNA wiper) is a dedicated kit for 1st strand cDNA synthesis that includes the removal step of genomic DNA. Compared with the previous generation of HiScript Reverse Transcriptase, the HiScript II Reverse Transcriptase in this kit has greatly improved thermal stability, template binding affinity and inhibitor tolerance. The gDNA wiper used in this kit can quickly remove genomic DNA contamination within 2 min, ensuring more reliable subsequent results and simplifying the design of qPCR primers without the need to span an exon-exon junction. 10 × RT Mix contains optimized buffer system and dNTP; HiScript II Enzyme Mix contains HiScript II Reverse Transcriptase and RNase inhibitor. The Oligo (dT)23VN included in this product has the stronger anchoring ability of Poly A+ RNA than Oligo (dT)18, making reverse transcription more efficient. Oligo (dT)23VN, Random primers or Gene Specific Primers (GSP) can be selected as reverse transcription primers according to requirements. With flexible and optional subsequent steps, the kit can be used to synthesize full-length cDNA (up to 20 kb) for cloning or efficiently synthesize the highly uniform cDNA for qPCR.
• Storage: Store at -30 ~ -15°C and transport at ≤0°C.
• Note: For research use only
• Application notes: Reliable reverse transcription efficiency: It has strong temperature tolerance (50 ~ 55°C), ensuring that the complex secondary structure of RNA can be opened under high temperature conditions to obtain a longer cDNA. Broad template RNA input: Up to 15 kb cDNA can be obtained from 1 pg - 5 μg total RNA. High cDNA synthesis efficiency: Speicific Anchored Oligo(dT)23VN, ensuring success and efficiency of cDNA synthesis. Selectable primers: Anchored Oligo(dT)23VN and Random hexamers are available individually packaged. Efficiency gDNA elimination: Effective elimination of up to 500 ng of gDNA.
• Expiration Date: Please enquire.